100% material declaration data sheet fgg676 PK111 (v1.2) september 27, 2006 ma terial declaration data sheet average weight: 3.0620 g component substance description cas# or description % of component use in product component weight/ substance weight (in grams) component % of total silicon die 0.1421 4.64% silicon 7440-21-3 100.00 0.1421 die attach material 0.0124 0.40% silver 7440-22-4 78.00 0.0097 resin trade secret 22.00 0.0027 mold compound 1.0269 33.54% epoxy resins trade secret 12.00 0. 1232 sio2 60676-86-0 88.00 filler 0.9037 laminate 1.1419 37.29% laminate trade secret 49.15 0.5613 solder mask trade secret 7.69 0.0878 copper 7440-50-8 40.83 metal layer 0.4662 nickel 7440-02-0 1.95 metal layer 0.0223 gold 7440-57-5 0.38 metal layer 0.0043 bond wire 0.0235 0.77% gold 7440-57-5 99.00 0.023302516 silver 7440-22-4 0.0025 0.000000588 copper 7440-50-8 0.0005 0.000000118 iron 7439-89-6 0.0005 0.000000118 calcium 7440-70-2 0.0020 0.000000471 palladium 7440-05-3 0.9900 0.000233025 magnesium 7439-95-4 0.0005 0.000000118 solder balls 0.7153 23.36% tin 7440-31-5 95.50 0.6831 silver 7440-22-4 4.00 0.0286 copper 7440-50-8 0.50 0.0036 PK111 (v1.2) september 27, 2006 www.xilinx.com 1 ? 2006 xilinx, inc. all rights reserved. a ll xilinx trademarks, registered trademarks, patents, and di sclaimers are as listed a t http://www.xilinx.com/legal.htm . all other trademarks and registered trademarks are the property of their respective owners. all specifications are subject to c hange without notice. xilinx believes this environmental information to be correct, but cannot guarantee its completeness or accuracy as it is based on data received from sources outside our company.
100% material declaration data sheet ? fgg676 2 www.xilinx.com revision history the following table shows the revi sion history for this document. date revision revision 3/21/06 1.0 initial release. 5/15/06 1.1 100% material declaration. 9/27/06 1.2 updated component descriptions. PK111 (v1.2) september 27, 2006
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